HN-600 Intaglio Print Copper Plating
Commodity Name
HN-600 Intaglio Print Copper Plating
Composition and Working Conditions
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Copper sulfate
Pure sulfuric acid
Chloride ion
Solid copper brightener HN-602
Solid copper Make up Solution HN-603
Temperature
Current density in cathode
Anode
Area ratio of cathode and anode
Immersion degree
Filtration
Consumption:
SilidcopperadditiveHN-601
Solid copper brightener HN-602
Silid copper Make up Solution HN-603
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200~280g/L
55~70g/L
80~150mg/L
2~3mL/L
4~6mL/L
35~45℃
15~30 A/dm2
Phosphorous copper
1:4-8
Completely immersion or semi-immersion
Continuous filtration
80-120mL/1000A.H
80-120mL/1000A.H
40-50mL/1000A.H
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Application and Advantage
1. Fine grained structure, high-temperature resistance.
2. Excellent anti-oxidation and anti-tarnish ability.
3. The hardness of deposit is spread evenly, can keep for months without change.
4. The hardness of deposit is 180~220HV, is beneficial to obtain good intaglio print.
5. The deposit surface is smooth after plating, good overall performance. It can save polishing time.
6. Suitable for intaglio print copper plating.