HN-WS Non-cyanide White Copper Tin Plating Process
Commodity Name
HN-WS Non-cyanide White Copper Tin Plating Process
Composition and Working Conditions
K4P2O7 200-300 g/L
Cu2P2O7 12-20 g/L
Sn2P2O7 10-14 g/L
Make-up Additive HN-WSM 15-25mL/L
Temperature 15-30℃
pH Value 8.0-9.0
Cathode Current Density 0.4-2.0 A/dm2
Anode Electrolytic Copper Anode
Deposition Rate each 3 min depositing 1μm under1 A/dm2
Agitation uniform air agitation
Filtration continuous 5um recycling filtration
Cell steel cell with plastics inside or plastic cell
Application and Advantage
1. The plating solutions are completely free of cyanide, safe and environment-friendly.
2. The plating solutions are completely free of heavy metals (Pb, Cd, Hg, etc ), PBB, PBDE and other
hazardous substance, meeting RoHS requirement.
3. The soldering performance is good.
4. The plating coating is quite bright and is in fine grained crystal structure. The color brightness is as
good as that of bright nickel solution.
5. This process is stable, and is easy to operate. Both rack plating and barrel plating are available.
6. It is suitable for the plating of general jewelry, wear-resistance mobile phone components, telecommunication components, connector, etc.