Rack Plating                     Barrel Plating

CuCN                                          9-12g/l                              9-12g/l

NaCN                                          45-55g/l                            45-55g/l

Na2SnO3                                    50-60g/l                           50-60g/l

NaOH                                          15-18g/l                           15-18g/l

KNaC4H4O6·4H2O                     130-150g/l                       130-150g/l

HN-BSA                                       3-4ml/l                              3-4ml/l

HN-BSB                                       4-5ml/l                              4-5ml/l

Temperature                               60-70℃                           50-60℃

Cathode Current Density            0.7-1.2 A/dm²                        0.7-1.2 A/dm²

Anode                                         graphite panel                 graphite panel

Filtration                                      Continuous Recycling filtration

HN-BSB：White Copper Tin Additive

1. The plating speed is quite fast, and the layer thickness in high potential region is uniform, the brightness is in consistency.

2. The adhesion between the coating and the base materials is good.

3. The plating coating is flexible without pinholes and pits. The anti-corrosion is good.

4. The process is stable and is easy to operate and control.