HN-CS200 Non-Cyanide Alkali Copper Plating
Commodity Name
HN-CS200 Non-Cyanide Alkali Copper Plating
Composition and Working Conditions

 

Make up Part A HN-CS100A

Make up Part B HN-CS100B

Brightener HN-CS200

Replenisher HN-CS300

Cu content

Temperature

pH

Anode current density

Anode

Agitation

350-450mL/L 

80-120mL/L

1-3mL /L

periodical replenish to maintain the concentration.

3-5g/L

50-60℃

9-10

0.4-2.0A/dm2

Electrolytic copper

even air agitation

 

Application and Advantage

 

1. The plating bath is completely cyanide-free and environment friendly.

2. The plating bath does not contain some heavy metals and other SVHC, e.g. Pb, Cd, Hg, PBB, PBDE, and meets RoHS requirement.

3. Iron, copper, bronze, steel, Zi/Al and Electroless Nickel can be plating, both rack/barrel plating are available.

4. It promotes a dense, fine-grained and flexible layer with good adhesion.

5. Copper layer directly turns black or oxidizes as different color, applicable to photo frame, light decoration, furniture, etc.

6. Disposal of waste becomes simple because the solution does not contain complexing agent.

7. The total cost will be reduced as copper anode is dissolved while electrolyzing, which reduces the make-up solution yield.